1954-S Repunched Mintmark RPM-002

Description

The 1954-S Repunched Mintmark RPM-002 exhibits a repunched mintmark where the small steel mintmark punch was applied more than once to the working die, leaving visible traces of the initial placement. This Lincoln cent was struck at the San Francisco Mint, weighing 3.11 grams with a diameter of 19.05 mm. Die markers: UVC-514 DMR-004 Stage A: EDS (unconfirmed) Stage B: Numerous die scratches North-South on Obverse – EMDS Numerous die scratches North-South on Reverse – EMDS Stage C: Light die scratches North-South on Obverse – MDS Light die crack in hair Die crack at lower tip of 9 of date Light die scratches North-South on Reverse – MDS Stage D: Die crack over V. D. B. – LMDS Die break left wheat grains – LMDS Die crack lower Right wheat to rim Die crack on T of CENT UVC-515 DMR-005 Stage E: Obverse is LDS Reverse die changed – EMDS Heavy die gouge between lower Left wheat and rim Stage F: Obverse is LDS Die crack lower Right wheat grains – MDS Stage G: Obverse die cracks heavier – VLDS Reverse die gouges worn away – LDS Stage H: Obverse is VLDS Die crack Right wheat lines to rim – VLDS UVC-1158 DMR-023 Stage I: Die crack from 5 to lower mintmark – VVLDS Reverse die changed – EMDS     Stage J: Die break from 5 to lower mintmark (AKA SJ mintmark) – VVLDS Reverse is MDS     Stage K: Obverse is VVLDS Die break in lower Right wheat grains– MDS     Stage L: Die break from 9 to upper mintmark – VVLDS Reverse is MDS.

Die Markers

• UVC-514
• DMR-004
• Stage A:
• EDS (unconfirmed)
• Stage B:
• Numerous die scratches North-South on Obverse – EMDS
• Numerous die scratches North-South on Reverse – EMDS
• Stage C:
• Light die scratches North-South on Obverse – MDS
• Light die crack in hair
• Die crack at lower tip of 9 of date
• Light die scratches North-South on Reverse – MDS
• Stage D:
• Die crack over V. D. B. – LMDS
• Die break left wheat grains – LMDS
• Die crack lower Right wheat to rim
• Die crack on T of CENT
• UVC-515
• DMR-005
• Stage E:
• Obverse is LDS
• Reverse die changed – EMDS
• Heavy die gouge between lower Left wheat and rim
• Stage F:
• Obverse is LDS
• Die crack lower Right wheat grains – MDS
• Stage G:
• Obverse die cracks heavier – VLDS
• Reverse die gouges worn away – LDS
• Stage H:
• Obverse is VLDS
• Die crack Right wheat lines to rim – VLDS
• UVC-1158
• DMR-023
• Stage I:
• Die crack from 5 to lower mintmark – VVLDS
• Reverse die changed – EMDS
• Stage J:
• Die break from 5 to lower mintmark
• (AKA SJ mintmark) – VVLDS
• Reverse is MDS
• Stage K:
• Obverse is VVLDS
• Die break in lower Right wheat grains– MDS
• Stage L:
• Die break from 9 to upper mintmark – VVLDS
• Reverse is MDS

External References