1954-S Repunched Mintmark RPM-001

Description

The 1954-S Repunched Mintmark RPM-001 shows mintmark repunching evidence from the hand-punching process used at the Philadelphia Mint to apply branch mint letters to working dies. This Lincoln cent was struck at the San Francisco Mint, weighing 3.11 grams with a diameter of 19.05 mm. Die markers: UVC-512 DMR-002 Stage A: Small die gouge dot over Y of LIBERTY – EMDS Die break in upper Left wheat grains – LDS UVC-513 DMR-003 Stage B: Light die crack in hair – MDS Reverse die changed – MDS Stage C: Die crack on 1 and 9 date – LDS Die crack on forehead Reverse is LDS Stage D: Die crack in upper 9 of date – VLDS Die chip on T of CENT – VLDS Die crack in Right wheat grains Stage E: Low fill die chip in upper 9 of date – VLDS Die chip in Left wheat grains – VLDS Stage F: Obverse is VLDS Die chip in Right wheat grains – VLDS Stage G: Die chip in upper 9 of date – VLDS Rdate die chip inside 1 of date Reverse is VLDS UVC-3494 DMR-030 Stage H: Obverse is VLDS Reverse die changed – EDS.

Die Markers

• UVC-512
• DMR-002
• Stage A:
• Small die gouge dot over Y of LIBERTY – EMDS
• Die break in upper Left wheat grains – LDS
• UVC-513
• DMR-003
• Stage B:
• Light die crack in hair – MDS
• Reverse die changed – MDS
• Stage C:
• Die crack on 1 and 9 date – LDS
• Die crack on forehead
• Reverse is LDS
• Stage D:
• Die crack in upper 9 of date – VLDS
• Die chip on T of CENT – VLDS
• Die crack in Right wheat grains
• Stage E:
• Low fill die chip in upper 9 of date – VLDS
• Die chip in Left wheat grains – VLDS
• Stage F:
• Obverse is VLDS
• Die chip in Right wheat grains – VLDS
• Stage G:
• Die chip in upper 9 of date – VLDS
• Rdate die chip inside 1 of date
• Reverse is VLDS
• UVC-3494
• DMR-030
• Stage H:
• Obverse is VLDS
• Reverse die changed – EDS

Attribution History

• Discovered by Unknown, Harry Ellis, Paul Funaiole
• Expert attribution by VarietyVista

External References