View All 1988 (P) Lincoln Memorial Cent

1988P-1DEO-009T Trail Die Obverse

Error
1988 (P) Cent Trail Die Obverse error coin
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Verified LegacyTrail Die Obverse

Attribution

T

Verified by

Trail Dies

Market Value
N/A
Rarity Index
N/A
Discovery Date
1988
Last Sold
N/A

Description

Found by Cal Goddard — his fourth trail die obverse discovery for the 1988-P date — 1988P-1DEO-009T on the Lincoln Memorial cent carries its most distinctive marker on the reverse rather than the obverse. The obverse in Stage A (early die state) presents no significant markers, which is common among trail die obverses where the trail impression itself may be the only distinguishing obverse feature. On the reverse, also in early die state, a die chip on the bottom stair line of the Memorial under the left urn provides the primary attribution marker. Die chips — small pieces of the die face that break away, leaving a corresponding raised lump on the struck coin — are particularly durable markers because the missing die material cannot be restored through polishing or abrading, meaning the chip persists across all die states until the die is retired. The stair area of the Lincoln Memorial reverse is structurally complex in die form, with multiple fine parallel lines representing the Memorial steps creating stress concentration points where chips are more likely to develop. Cal Goddard's four trail die obverse discoveries for 1988-P (1DEO-006T through 1DEO-009T) suggest systematic roll searching focused specifically on Philadelphia cents from this production year. Struck at the Philadelphia Mint on copper-plated zinc planchets composed of 97.5% zinc and 2.5% copper, weighing 2.5 grams at 19mm diameter.

Die Markers

  • Stage “A “, obverse is EDS – none noted
  • Reverse is EDS – a die chip is seen on the bottom stair line of the Memorial building under the left URN

Attribution History

  • Discovered by Cal Goddard
  • Expert attribution by Trail Dies

External References

Additional Notes

This die was found by Cal Goddard. .

Last updated: August 31, 2026

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