View All 1968 (D) Lincoln Memorial Cent

1968-D Repunched Mintmark RPM-007

Error
1968 (D) Cent Repunched Mint Mark error coin
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Verified LegacyRepunched Mint Mark

Attribution

V

Verified by

VarietyVista

Market Value
N/A
Rarity Index
N/A
Discovery Date
1968
Last Sold
N/A

Description

The seventh and final cataloged repunched mint mark for the 1968-D Lincoln cent, RPM-007 is a D/D variety with the second impression rotated clockwise relative to the first — a configuration that produces a distinctive ghost image of the D mint mark offset at an angle from the final, correctly oriented punch. Rotated RPMs are among the more visually striking repunched mint mark varieties because the angular displacement creates a broader and more complex pattern than a simple directional shift, with portions of the original D visible at positions that a straight north-south or east-west repunch would not reach. The clockwise rotation indicates that the mint mark punch was twisted between impressions, possibly because the engraver adjusted the tool's orientation to correct a perceived misalignment or simply because the punch rotated in the hand during the second strike. RPM-007 carries die markers UVC-1155 and DMR-011, with three documented die stages showing progressive deterioration. Stage A (EDS) displays a die chip above the E of WE on the obverse, with the reverse in early die state. Stage B (MDS) shows the deterioration spreading: die chips have developed above both the D of GOD and the E of WE on the obverse, a die crack has appeared over the designer's initials V.D.B. on the reverse, and both surfaces show mid die state characteristics. Stage C (LDS) is unconfirmed. The V.D.B. die crack on the reverse is a notable feature because the designer's initials are positioned at the base of Lincoln's bust — a location that experiences concentrated stress during striking. Attributed by VarietyVista. Struck on a 3.11-gram, 19mm planchet of 95% copper and 5% zinc at the Denver Mint.

Die Markers

  • UVC-1155
  • DMR-011
  • Stage A:
  • Die chip above E of WE – EDS
  • Reverse is EDS
  • Stage B:
  • Die chips above D of GOD and E of WE – MDS
  • Die crack over V.D.B.
  • Reverse is MDS
  • Stage C:
  • LDS (unconfirmed)

Attribution History

  • Discovered by Gary B. Shaffstall
  • Expert attribution by VarietyVista

External References

Additional Notes

D/D Rotated CW.

Last updated: August 31, 2026

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