1955-S Repunched Mintmark RPM-003

Description

The 1955-S Repunched Mintmark RPM-003 displays repunched mintmark diagnostics from the manual mintmark application process, where a corrective second punch was needed after initial misplacement. This Lincoln cent was struck at the San Francisco Mint, weighing 3.11 grams with a diameter of 19.05 mm. Die markers: UVC-547 DMR-005 Stage A: EDS (unconfirmed) Stage B: Short die gouge from shoulder under Y of LIBERTY – MDS Reverse is MDS Stage C: Die crack on shoulder fold – LDS One small and one large die chip in Left wheat grains – LDS One small and one medium die chip in Left wheat lines Medium die chip outside Left wheat grains Three small die chips in Right wheat grains Medium die chip in Right wheat lines Die crack lower Right wheat to rim Medium die chip on T of CENT UVC-548 DMR-006 Stage D: Die crack at lower left tip of B of LIBERTY – LDS Die gouge from lapel to rim Reverse die changed – EDS Stage E: Die crack at top Left tip of B of LIBERTY – VLDS Reverse is EDS     Stage F: Long die gouge through lower vest – VLDS Reverse is EMDS.

Die Markers

• UVC-547
• DMR-005
• Stage A:
• EDS (unconfirmed)
• Stage B:
• Short die gouge from shoulder under Y of LIBERTY – MDS
• Reverse is MDS
• Stage C:
• Die crack on shoulder fold – LDS
• One small and one large die chip in Left wheat grains – LDS
• One small and one medium die chip in Left wheat lines
• Medium die chip outside Left wheat grains
• Three small die chips in Right wheat grains
• Medium die chip in Right wheat lines
• Die crack lower Right wheat to rim
• Medium die chip on T of CENT
• UVC-548
• DMR-006
• Stage D:
• Die crack at lower left tip of B of LIBERTY – LDS
• Die gouge from lapel to rim
• Reverse die changed – EDS
• Stage E:
• Die crack at top Left tip of B of LIBERTY – VLDS
• Reverse is EDS
• Stage F:
• Long die gouge through lower vest – VLDS
• Reverse is EMDS

External References