1955-S Repunched Mintmark RPM-002

Description

The 1955-S Repunched Mintmark RPM-002 bears a repunched mintmark created when the engraver struck the mintmark punch into the die face at least twice, with the second impression slightly offset from the first. This Lincoln cent was struck at the San Francisco Mint, weighing 3.11 grams with a diameter of 19.05 mm. Die markers: UVC-546 DMR-004 Stage A: EDS (unconfirmed) Stage B: Obverse and Reverse are MDS Stage C: Obverse is LDS Small die chip in Right wheat grains – LDS Stage D: Obverse is LDS Large die chip in Right wheat grains – LDS Stage E: Small die chip in upper first 5 of date – LDS Two light die cracks on coat Two die chips in Right wheat grains Stage F: Large die chip in upper first 5 of date – LDS Minute die chip in upper last 5 of date Die crack on lapel Reverse is LDS Stage G: Obverse is LDS Die crack lower Right wheat to rim – LDS Stage H: Obverse is VLDS Third die chip in Right wheat – VLDS Die chip on T of CENT Stage I: Die chip under E of LIBERTY – VLDS Reverse is VLDS Stage J: Die chip in upper last 5 of date, 1/2 chipped out – VLDS Die break Right wheat to rim – VLDS Second die crack lower Right wheat to rim Stage K: Obverse is VLDS Die break 3/4 way from upper to lower crack – VLDS Stage L: Die chip in upper 9 of date – VLDS Retained cud at lower Right wheat – VLDS.

Die Markers

• UVC-546
• DMR-004
• Stage A:
• EDS (unconfirmed)
• Stage B:
• Obverse and Reverse are MDS
• Stage C:
• Obverse is LDS
• Small die chip in Right wheat grains – LDS
• Stage D:
• Obverse is LDS
• Large die chip in Right wheat grains – LDS
• Stage E:
• Small die chip in upper first 5 of date – LDS
• Two light die cracks on coat
• Two die chips in Right wheat grains
• Stage F:
• Large die chip in upper first 5 of date – LDS
• Minute die chip in upper last 5 of date
• Die crack on lapel
• Reverse is LDS
• Stage G:
• Obverse is LDS
• Die crack lower Right wheat to rim – LDS
• Stage H:
• Obverse is VLDS
• Third die chip in Right wheat – VLDS
• Die chip on T of CENT
• Stage I:
• Die chip under E of LIBERTY – VLDS
• Reverse is VLDS
• Stage J:
• Die chip in upper last 5 of date, 1/2 chipped out – VLDS
• Die break Right wheat to rim – VLDS
• Second die crack lower Right wheat to rim
• Stage K:
• Obverse is VLDS
• Die break 3/4 way from upper to lower crack – VLDS
• Stage L:
• Die chip in upper 9 of date – VLDS
• Retained cud at lower Right wheat – VLDS

External References