2015 Doubled Die Reverse WDDR-002
Error
Description
Extra thickness shows on the designer’s initials JFM and the letters in USA with the strongest spread in AMERICA. Die Markers: Obverse: Stage A: Die chip in the V in VDB. Die gouge inside lower 5 in the date. Stage B: A small die gouge can be found to the left of the upper 5. Reverse: Stage A: A die crack is present on the top of the left side of the shield. A pre-die crack depression can be found north of the LU in PLURIBUS. Minute die gouge left of R in AMERICA. Stage B: A new die chip is present north of the LU in PLURIBUS in the die crack. Die gouge left of R in AMERICA still visible. Submitted By: Stage A: Daniel Griffin, Stage B: Ed Burrell Cross References: 2015P-1DR-001 Obverse: Die pitting can be found in and above thehair above the front of the forehead. Adie crack runs NNW into the forehead from the front of the eyebrow. Reverse: A die crack and die chips can be found on the top left of the shield.
Attribution History
- Discovered by Stephen Young Cross References: CONECA: 1-R-IV+VIII
- CONECA: 1-R-IV+VIII; Wexler Variety ID: 2015 1¢ WDDR-002
- Expert attribution by Wexler Team