1960-D Repunched Mintmark RPM-003
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Description
Boasting ten documented die stages across two reverse die pairings, RPM-003 holds the distinction of the most extensively staged repunched mintmark in the entire 1960-D Lincoln Memorial cent series. Cataloged by VarietyVista as UVC-639/DMR-007 and UVC-640/DMR-008, this variety traces the complete life cycle of an obverse die from early die state through terminal deterioration. Under the first reverse die (UVC-639/DMR-007), Stages A through E document the initial production run, capturing the gradual weakening of the secondary mintmark impression and the accumulation of die cracks and chips that characterize progressive die failure. After the reverse die change (UVC-640/DMR-008), Stages F through J continue the progression under a fresh reverse, allowing collectors to observe how the obverse die's condition continued to deteriorate independently of the reverse. The ten-stage span is remarkable — it indicates this particular obverse die remained in service long enough to consume two complete reverse dies, producing coins across a wide spectrum of die states. Denver's Large Date production in 1960 consumed working dies rapidly, and the extensive staging of RPM-003 provides a detailed case study in die longevity under high-volume minting conditions.
Die Markers
- UVC-639
- DMR-007
- Stage A:
- Weak secondary mintmark – EDS
- Reverse is EDS
- Stage B:
- Obverse is EDS
- Depression on Right cornice – EDS
- Die break at left upper base
- Die chip on column # 1
- Stage C:
- Obverse is EMDS
- Die chip on Right cornice – EMDS
- Depression under Left base
- Stage D:
- Obverse is MDS
- Larger die chip on Right cornice – MDS
- Larger die break at left upper base
- Larger die chip on column # 1
- Stage E:
- Obverse is LMDS
- Die chip under Left base – LMDS
- UVC-640
- DMR-008
- Stage F:
- Die crack in the hair – LMDS
- Reverse die changed – EDS
- Stage G:
- Strong secondary mintmark – LDS
- Heavy die crack behind ear
- Die chip on Left base – MDS
- Depression in upper E of ONE
- Small die chip on column # 1
- Stage H:
- Obverse is LDS
- Die chip under Left base – LMDS
- Stage I:
- Obverse is LDS
- Die break at Left upper base – MDS
- Stage J:
- Obverse is VLDS
- Larger die break at Left upper base – MDS