1961-D Repunched Mintmark RPM-003

Description

Documented by VarietyVista, RPM-003 on the 1961-D Lincoln Memorial Cent is a repunched mintmark variety tracked across two die marriage records — DMR-005 (UVC-768) and DMR-006 (UVC-769) — with five total die stages documenting the working die's progression from early service through late deterioration. Under the first die pairing (DMR-005, UVC-768), Stage A presents the obverse in early die state, while the reverse already shows mid-to-late die state characteristics: a die chip on Memorial column 1, a die crack outside column 12, a die chip on the C of CENT, a die crack on the E of ONE, and a die crack on the E of CENT. This unusual combination of a fresh obverse paired with a deteriorating reverse suggests the obverse die was installed as a replacement for a previously worn obverse in an existing press setup. Stage B finds the obverse progressed to early-mid die state, with a small die chip forming under the right base of the Memorial in late-mid die state condition, and die cracks appearing on columns 2, 10, 11, and 12. By Stage C (mid die state obverse), a die break has developed outside upper column 12 in late die state, and the die chip under the right base has grown larger. When the failing reverse was replaced (DMR-006, UVC-769), Stage D introduces a light die crack over the V.D.B. designer's initials at mid die state, with east-west die scratches across the obverse and a fresh mid die state reverse. The terminal Stage E (late die state) shows a die chip forming between the 6 and 1 of the date, a die crack in the hair, a die gouge behind the ear and under the bust, and a die chip on column 1 at mid die state. The five stages across two die marriages reveal a die that saw heavy use, with particularly notable reverse deterioration driving the mid-life reverse die change.

Die Markers

• UVC-768
• DMR-005
• Stage A:
• Obverse is EDS
• Die chip on column # 1 – MDS
• Die crack outside column #12
• Die chip on C of CENT
• Die crack on E of ONE
• Die crack on E of CENT
• Stage B:
• Obverse is EMDS
• Small die chip under Right base – LMDS
• Die crack on columns # 2, 10, 11, and 12
• Stage C:
• Obverse is MDS
• Die break outside upper column #12 – LDS
• Larger die chip under Right base
• UVC-769
• DMR-006
• Stage D:
• Light die crack over V.D.B. – MDS
• Die scratches East-West over Obverse
• Reverse die changed – MDS
• Stage E:
• Die chip between 6 and 1 of date – LDS
• Die crack in the hair
• Die gouge behind ear and under the bust
• Die chip on column # 1 – MDS

External References