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1954-S Repunched Mintmark RPM-004

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1954-S Repunched Mintmark RPM-004
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Verified LegacyRepunched Mint Mark

Attribution

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Market Value
N/A
Rarity Index
N/A
Discovery Date
1954
Last Sold
N/A

Description

The 1954-S Repunched Mintmark RPM-004 is a repunched mint mark variety of the United States cent. This variety was discovered on the 1954 (S) Lincoln Wheat Cent, part of the Lincoln Wheat Cents 1909-1958 series. Die markers: UVC-517 DMR-007 Stage A: EDS (unconfirmed) Stage B: Obverse and Reverse are MDS Stage C: Die crack on shoulder – LMDS Die crack on forehead Die gouge Southwest from first S of STATES – LMDS Stage D: Obverse is LDS Two small die chips in Left wheat grains – LDS Die crack on T of CENT Stage E: Obverse is LDS Small die chip in Left wheat lines – LDS Die chip on T of CENT Stage F: Die chips on 9 of date – VLDS Die crack on lapel Die chip in Left wheat grains – VLDS Die crack in Right wheat grains Stage G: Obverse is VLDS Die break in Left wheat grains – VLDS Stronger Reverse die chips and cracks Stage H: Die scratches North-South on Obverse – VLDS Die break covers 1/2 vertical upright of the T of CENT – VLDS UVC-518 DMR-008 Stage I: Obverse is VLDS Reverse die changed – EDS Stage J: Die crack BIE – VLDS Die chip in whole 9 of date Reverse is MDS Stage K: Die chip BIE – VLDS Reverse is LDS.

Die Markers

  • UVC-517
  • DMR-007
  • Stage A:
  • EDS (unconfirmed)
  • Stage B:
  • Obverse and Reverse are MDS
  • Stage C:
  • Die crack on shoulder – LMDS
  • Die crack on forehead
  • Die gouge Southwest from first S of STATES – LMDS
  • Stage D:
  • Obverse is LDS
  • Two small die chips in Left wheat grains – LDS
  • Die crack on T of CENT
  • Stage E:
  • Obverse is LDS
  • Small die chip in Left wheat lines – LDS
  • Die chip on T of CENT
  • Stage F:
  • Die chips on 9 of date – VLDS
  • Die crack on lapel
  • Die chip in Left wheat grains – VLDS
  • Die crack in Right wheat grains
  • Stage G:
  • Obverse is VLDS
  • Die break in Left wheat grains – VLDS
  • Stronger Reverse die chips and cracks
  • Stage H:
  • Die scratches North-South on Obverse – VLDS
  • Die break covers 1/2 vertical upright of the T of CENT – VLDS
  • UVC-518
  • DMR-008
  • Stage I:
  • Obverse is VLDS
  • Reverse die changed – EDS
  • Stage J:
  • Die crack BIE – VLDS
  • Die chip in whole 9 of date
  • Reverse is MDS
  • Stage K:
  • Die chip BIE – VLDS
  • Reverse is LDS

External References

Last updated: June 20, 2026