1954-S Repunched Mintmark RPM-004

Description

The 1954-S Repunched Mintmark RPM-004 bears a repunched mintmark created when the engraver struck the mintmark punch into the die face at least twice, with the second impression slightly offset from the first. This Lincoln cent was struck at the San Francisco Mint, weighing 3.11 grams with a diameter of 19.05 mm. Die markers: UVC-517 DMR-007 Stage A: EDS (unconfirmed) Stage B: Obverse and Reverse are MDS Stage C: Die crack on shoulder – LMDS Die crack on forehead Die gouge Southwest from first S of STATES – LMDS Stage D: Obverse is LDS Two small die chips in Left wheat grains – LDS Die crack on T of CENT Stage E: Obverse is LDS Small die chip in Left wheat lines – LDS Die chip on T of CENT Stage F: Die chips on 9 of date – VLDS Die crack on lapel Die chip in Left wheat grains – VLDS Die crack in Right wheat grains Stage G: Obverse is VLDS Die break in Left wheat grains – VLDS Stronger Reverse die chips and cracks Stage H: Die scratches North-South on Obverse – VLDS Die break covers 1/2 vertical upright of the T of CENT – VLDS UVC-518 DMR-008 Stage I: Obverse is VLDS Reverse die changed – EDS Stage J: Die crack BIE – VLDS Die chip in whole 9 of date Reverse is MDS Stage K: Die chip BIE – VLDS Reverse is LDS.

Die Markers

• UVC-517
• DMR-007
• Stage A:
• EDS (unconfirmed)
• Stage B:
• Obverse and Reverse are MDS
• Stage C:
• Die crack on shoulder – LMDS
• Die crack on forehead
• Die gouge Southwest from first S of STATES – LMDS
• Stage D:
• Obverse is LDS
• Two small die chips in Left wheat grains – LDS
• Die crack on T of CENT
• Stage E:
• Obverse is LDS
• Small die chip in Left wheat lines – LDS
• Die chip on T of CENT
• Stage F:
• Die chips on 9 of date – VLDS
• Die crack on lapel
• Die chip in Left wheat grains – VLDS
• Die crack in Right wheat grains
• Stage G:
• Obverse is VLDS
• Die break in Left wheat grains – VLDS
• Stronger Reverse die chips and cracks
• Stage H:
• Die scratches North-South on Obverse – VLDS
• Die break covers 1/2 vertical upright of the T of CENT – VLDS
• UVC-518
• DMR-008
• Stage I:
• Obverse is VLDS
• Reverse die changed – EDS
• Stage J:
• Die crack BIE – VLDS
• Die chip in whole 9 of date
• Reverse is MDS
• Stage K:
• Die chip BIE – VLDS
• Reverse is LDS

External References